Kintex ™  7 FPGA can achieve excellent cost/performance/power balance for your design at 28nm node, and provide high DSP rate, high cost performance package, and support PCIe ®  Gen3, 10 Gigabit Ethernet and other mainstream standards. The kinex 7 series is ideal for applications such as 3G/4G wireless, flat panel displays, and video over IP solutions.

Virtex ™  UltraScale+ ™  The device provides the highest performance and integration function on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnection (SSI) technology to break the limitation of Moore's law and achieve the highest signal processing and serial i/o bandwidth to meet the most stringent design requirements. It also provides a virtual monolithic design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

As the most powerful FPGA Series in the industry, ultrascale+devices are the perfect choice for computing intensive applications: from 1+tb/s networks, machine learning to radar/warning systems

Zynq ™  7000 SOC series integrated arm ®  The software programmability of the processor and the hardware programmability of FPGA can not only realize important analysis and hardware acceleration, but also highly integrate CPU, DSP, ASSP and mixed signal functions on a single device. Zynq 7000 series includes single core zynq7000s devices and dual core zynq-7000 devices. It is a fully scalable SoC platform with excellent cost performance per unit power consumption, which can fully meet your unique application requirements.

Monolithic integration of direct RF sampling data converter on adaptive SOC can eliminate the need for external data converter, thus realizing a highly flexible solution. Compared with multi-component solution, this solution can reduce power consumption and space occupation by 50%, including eliminating high-power FPGA analog interfaces such as jesd204. In addition, this method can also achieve a highly flexible solution, transferring most of the RF signal processing to the digital domain. Zynq ™  UltraScale+ ™  Rfsoc integrates soft decision forward error correction cores (sd-fec) IP blocks with low density parity check (LDPC) and turbo codec support. The hardened core can provide more than 1GB/s performance at low latency, and has lower power consumption and smaller footprint than the soft logic implementation scheme. Zynq rfsoc DFE is the latest adaptive rfsoc platform, which integrates IP harder than soft logic for important DFE processing. Zynq rfsoc DFE can achieve a highly flexible solution for 5g new radio, and can operate up to 7.125ghz input and output frequency with low power consumption and low cost. Zynq ultrascale+rfsoc architecture integrates FPGA architecture, which can flexibly meet a wide range of requirements of the same basic hardware. Can use the same platform to meet different requirements and emerging standards, so manufacturers can quickly respond to new market opportunities. Zynq ultrascale+rfsoc is a heterogeneous computing architecture, including a complete arm processing subsystem, FPGA architecture, and complete analog-to-digital programmability in the RF signal chain. It can not only provide a complete monolithic software defined radio platform for different applications, but also help to produce radio variants with the development of market dynamics.

Virtex ™  FPGA is optimized for 28nm system performance and integration, which can bring excellent power performance ratio architecture, DSP performance and i/o bandwidth to your design. The series can be used in 10g to 100g networking, portable radar, ASIC prototype design and other applications.

Zynq ™  UltraScale+ ™  MPSoC devices not only provide 64 bit processor scalability, but also combine real-time control with software and hardware engines to support graphics, video, waveform and packet processing. On the platform containing general-purpose real-time processor and programmable logic, three different variants include dual core application processor (CG) devices, quad core application processor and GPU (eg) devices, and video codec (EV) devices, creating unlimited possibilities for 5g wireless, next-generation ADAS and industrial Internet of things.

Spartan ™  6 devices provide industry-leading connection functions, such as high logic pin ratio, small size package MicroBlaze ™  Soft processors and various supported i/o protocols. It is an ideal choice for advanced bridging applications in consumer products, automotive infotainment systems and industrial automation applications.

VVirtex ™  UltraScale ™  The device provides the best performance and integration at 20nm, including serial i/o bandwidth and logic capacity. As the industry's only high-end FPGA in the 20nm process node, this series is suitable for applications from 400g network to large-scale ASIC prototype design/simulation

Kintex ®  UltraScale ™  The device provides the best cost/performance/power ratio at 20nm node, including the highest signal processing bandwidth in mid-range devices, next-generation transceivers and low-cost packages, to achieve the best combination of performance and cost-effectiveness. This series is suitable for packet processing for 100g network and data center applications, as well as DSP intensive processing for next-generation medical imaging, 8k4k video and heterogeneous wireless infrastructure.

Artix ™  7 devices provide high-performance power consumption ratio architecture, transceiver line speed, DSP processing capacity and AMS integration in a single cost optimized FPGA. Contains MicroBlaze ™  Supported by soft processor and 1066mb/s DDR3 technology, this series provides the greatest value for various cost and power sensitive applications, including software defined radio, machine vision photography and low-end wireless return.

Spartan, a new member of cost optimization portfolio ™  The 7 device adopts small package and provides excellent performance power consumption ratio, which can meet the most stringent requirements. These devices include MicroBlaze ™  Soft processor, running speed over 200 DMIPS, with 800MB/s DDR3 support based on 28nm technology. In addition, Spartan 7 devices can provide integrated ADC, special safety functions and q-level (-40 ° C to+125 ° C) on all commercial devices. These devices are ideal for industrial, consumer and automotive applications, including applications such as arbitrary connection, sensor fusion and embedded vision.

Kintex ™  UltraScale+ ™  The device provides the best price performance ratio per watt in FinFET nodes, offering an economical and efficient solution for applications that require high-end functionality, including 33Gb/s transceivers and 100G connectivity cores. The latest mid-range product series supports both packet processing and DSP intensive functions, making it an ideal choice for applications such as wireless MIMO technology, Nx100G wired networks, as well as data center network and storage acceleration.